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Comprehensive Solutions

Services we offer

Turnkey electronic product engineering from napkin architecture and high-speed simulation to volume mass manufacturing and lifecycle sustainment.

Discipline 01

Hardware Development & Design

From mixed-signal analog circuitry to high-density multi-layer digital layouts with impedance control.

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System Architecture & Feasibility

Component trade-off analysis, power tree calculation, bus bandwidth budgeting, and thermal feasibility modeling.

Electronic Circuit Design

Precision analog front-ends, low-noise power supplies, sensor signal conditioning, and robust ESD/EMC surge protection.

PCB Design & Layout

Multi-layer routing (up to 16+ layers), HDI microvias, controlled impedance traces, and differential skew matching.

Prototype & NPI

Rapid quick-turn PCB fabrication, automated stencil printing, component procurement, and bring-up bench testing.

Obsolescence Management

Drop-in second-sourcing, pin-compatible redesigns, and continuous component lifecycle health monitoring.

Technical Documentation

Essential documentation includes production-ready fabrication drawings, assembly BOMs, pick-and-place centroids, and test station specifications.

Discipline 02

Embedded Software & Firmware

Reliable, secure code engineered for ARM Cortex, RISC-V, ESP32, STM32, and PIC architectures.

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Low-Level Firmware Coding

Bare-metal C/C++ driver development, memory management, DMA transfers, and ultra-low power sleep states.

BSP & Device Drivers

Board support packages for custom boards, Embedded Linux kernel configuration, and driver implementation.

RTOS Multithreading

Deterministic real-time scheduling on FreeRTOS and Zephyr with mutexes, semaphores, and message queues.

Secure Boot & FOTA

Dual-bank fail-safe firmware updates with cryptographic ECDSA signature verification and rollback protection.

Algorithm Porting & DSP

Digital signal filtering (FIR/IIR), sensor fusion, Kalman filters, and TinyML neural network inference.

Discipline 03

Connectivity & IoT Solutions

Connected intelligent nodes with cloud telemetry, ISO 26262 compliance, and automated HIL test rigs.

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Wireless Protocol Implementation

Designing and deploying low-power wireless stacks (BLE, Wi-Fi, Zigbee, LoRaWAN, Cellular IoT, and MQTT/CoAP) for reliable device-to-cloud communication.

Industrial IoT Gateways

Ruggedized gateways supporting 4G/LTE-Cat1, RS-485 isolation, and local edge processing for telemetry.

Automotive CAN-FD & ECUs

Automotive body control, climate management, and powertrain controllers built to ISO 26262 safety guidelines.

Hardware-in-the-Loop (HIL)

Automated regression test benches simulating physical loads, environmental temperatures, and sensor faults.

Ready to engineer your next embedded system?

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