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Precision calculators for PCB trace geometry, passive networks, RF microstrip impedance, and MCU peripherals based on IPC standards.

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IPC-2221 PCB Trace Width Calculator

Conductor width, cross-section area, resistance, and temperature rise

Trace Parameters

IPC-2221
Layer Placement

Computed Width & Characteristics

Required Width -- mils (0.001")
Metric Width -- millimeters (mm)
Area -- mils²
Resistance -- Ohms (Ω)
Voltage Drop -- Volts (V)
Power Loss -- Watts (W)

Live Trace Cross-Section

FR-4 Dielectric Substrate Trace Width
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Mathematical Formula & Engineering Rules

The IPC-2221 trace width calculation is based on the empirical formula relating current, temperature rise, and cross-sectional area:

I = k × (ΔT)0.44 × A0.725
  • I: Current in Amperes (A)
  • ΔT: Allowable temperature rise above ambient in °C
  • A: Cross-sectional area in mils2
  • k: Constant (0.048 for external layers, 0.024 for internal layers)
  • Width (W): W = Area / (Thickness × 1.378 mils/oz)
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Worked Engineering Example

Target: Carry 2.5A on an external layer with 1.0 oz copper and a 10°C allowable temperature rise over a 50mm length.

  1. Calculate cross-sectional area: A = (2.5 / (0.048 × 100.44))(1/0.725) = 34.6 mils2.
  2. Convert 1.0 oz copper to thickness: 1.0 oz = 1.378 mils (35 μm).
  3. Calculate required width: W = 34.6 mils2 / 1.378 mils = 25.1 mils (0.638 mm).
  4. Resulting trace resistance over 50mm: R ≈ 0.038 Ω with 0.095V voltage drop.
Engineering FAQ

Frequently Asked Questions

Q1:

Q2:

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